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TESCAN at M&M 2025: Client Needs Are at the Core of Everything We Do

Two researchers in lab coats reviewing data on a tablet and laptop in a modern laboratory.
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TESCAN Group is proud to unveil two software innovations at this year’s prestigious Microscopy & Microanalysis (M&M) conference in Salt Lake City, USA. These launches reflect TESCAN’s ongoing shift toward a more integrated approach, combining advanced technology, workflow-driven solutions, expert support, and a community built on shared insight. 

 

"Our goal is to shorten the time between the customer acquisition of a TESCAN solution, and the moment users unlock its full potential. We achieve that through smart automation, application know-how, and active customer engagement," explains Bruno Janssens, Chief Strategy Officer at TESCAN. 

Automation and Innovation 

TESCAN continues to innovate across its portfolio – following last year’s successful launch of several new instruments (including the plasma FIB-SEM Amber X 2). This year the company is focusing on automation across its entire product range. The aim is to simplify scientists’ workflows by increasing repeatability and reducing the need for constant operator input. TESCAN is introducing two software innovations at M&M: 

AutoSection 

AutoSection is an automation module built into TESCAN’s Essence™ software platform for FIB-SEM systems, enabling users to easily define a region for cross-sectioning. The system then mills fully automatically, using AI-driven end-pointing to stop precisely at the target feature — no over- or under-polishing. It is ideal for fault isolation and package inspection and fully integrated into laser and FIB-SEM workflows. AutoSection is most effective when paired with the Mistral plasma FIB and the Rocking Stage. 

TEM AutoPrep PRO – Inverted & Planar Lamella Automation 

The latest generation of TESCAN’s module for fully automated TEM sample preparation now supports both planar and inverted lamella orientations. Thanks to the patented OptiLift manipulator, the entire process is completed without manual intervention, re-welding, or the need for special stages. This enables speed and flexibility in preparing complex semiconductor and materials science samples. 

 

"We want to help our customers work faster and more efficiently – even in the most complex applications. We are committed to being a true growth partner to them," adds Sirine Assaf, Chief Revenue Officer at TESCAN. 

Investments, Acquisitions, and Global Growth 

TESCAN has significantly expanded its global presence recently. The company welcomed leading U.S. investor Carlyle, enabling further large-scale growth through acquisitions and investment in R&D. In the APAC region, TESCAN has entered several new companies, while in the Americas, it has launched new state-of-the-art laboratories equipped with the latest instruments. Part of this expansion also included the acquisition of EXpressLO products, designed to simplify instrument operation and accelerate access to high-quality results. 

 

"Our ambition is to continue expanding our footprint in key regions and market segments. Through both organic growth and strategic acquisitions, we are building a global brand that delivers not only top-tier technology but also an approach that genuinely supports scientists and engineers," closes Bruno Janssens, Chief Strategy Officer.